ILPH RS232/FO-S ABB

ILPH RS232/FO-S ABB Power module

Brand：ABB Model number：ILPH RS232/FO-S

Country of origin: Sweden Product weight：0.55KG

HS code：8517623990

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Rev.17 of the 56F803 Datasheet has two parts:

• The addendum to revision 16 of the datasheet, immediately following this cover page.

• Revision 16 of the datasheet, following the addendum. The changes described in the addendum have

not been implemented in the specified pages.

A complicating factor is the existence of three common definitions for determining the junction-to-case

thermal resistance in plastic packages:

• Measure the thermal resistance from the junction to the outside surface of the package (case)

closest to the chip mounting area when that surface has a proper heat sink. This is done to minimize

temperature variation across the surface.

• Measure the thermal resistance from the junction to where the leads are attached to the case. This

definition is approximately equal to a junction to board thermal resistance.

• Use the value obtained by the equation (TJ – TT)/PD where TT is the temperature of the package

case determined by a thermocouple.

The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so that the thermocouple junction rests on the package. A small amount of epoxy is placed over the ther mocouple junction and over about 1mm of wire extending from the junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling effects of the thermocouple wire.

When heat sink is used, the junction temperature is determined from a thermocouple inserted at theinterface between the case of the package and the interface material. A clearance slot or hole is normally required in the heat sink. Minimizing the size of the clearance is important to minimize the change in thermal performance caused by removing part of the thermal interface to the heat sink. Because of the experimental difficulties with this technique, many engineers measure the heat sink temperature and then back-calculate the case temperature using a separate measurement of the thermal resistance of the interface. From this case temperature, the junction temperature is determined from the junction-to-case thermal resistance.

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